Manufacturers in the fast-evolving electronics industry are leading the technological advancement. AI driven digitization and networks, Internet of things, Industry 4.0 and 5G or 6G technologies are all power hungry to an extend that GaN and SiC technologies have to be de-rated to prevent thermal issues degrading reliability. EPoS specializes in high-performance material solutions tailored specifically for power electronics manufacturing, offering innovative, cost-effective alternatives and novelties that meet the ever increasing needs.
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A unique speed to innovation
We develop new materials previously not feasible in less than one day with engineered properties for optimised thermal management and process integration
Fastest, leanest and most flexible production
Our unique processing method that combines powder press and sinter in a single step allows us to eliminate sinter furnaces and to reduce the production steps by 40-50%.
Consistent high Quality
Single piece production flow, full in-process control and meticolous analysis of data allow us to have the highest degree of control of what we produce and deliver.
Thin, netshape manufacturing at high precision
Our innovative e-forging process allows us to deliver high-precision components with thickness down to 0.5mm, particularly suitable for applications that require complex shapes or small parts.
Leading Sustainability
The eForging technology reduces the energy intense sintering to less than a second. This results in an product carbon footprint reduction compared to alternative manufacturing processes by 70-90%, while increasing at the same time increasing the material utilisation rate by 20-30%.
At EPoS, we combine powders of metals and ceramics to unique composition that take full advantage of the extremely fast Electro-Sinter-Forging process.
By leveraging precision engineering, our material science expertise, and the unique eForging process we assist the electronics industry to address major challenges in performance, supply chain disruptions and sustainability with high-quality solutions for demanding applications such as 5/6G, autonomous vehicles, and advanced consumer devices.
Mixing and milling process: Powder and composite engineering
High performance materials are crucially relying on the selection, precise dosing, and uniform mixing of powders. This fundamental step has been central to our activities from the start, guaranteeing consistency and reliability in the final products.
eForging: unique characteristics with high quality
Our electro-sinter-forging (e-forging) technology is the most efficient manufacturing technology on the market with respect to productivity, energy-efficiency and material utilisation while enabling precise ready to assemble components in high volume production.
Tumbling and deburring: ensuring flawless contours and edges
Precise surfaces and contours are pre-requisit for assembly processes like soldering, sintering or glueing. Tumbling and deburring ensures smooth transitions and avoids assembly interferences.
Commitment to quality, raw material availability and criticality
Quality is core to all our activities. We complement quality with transparent supply chains and our ambition to minimise criticlity with our engineered material compositions.
Thin precise tailored components to extract heat or protect with precision your semiconductor device:
Cu-Mo (Copper-Molybdenum)
The performant and versatile solution for semiconductor thermal management in unlimited composite configuration. The eForging processes allows to go beyond standard Mo70Cu30 and allows optimised CuXMoY combintions due to the extremly short sintering process.
Cu-W (Copper-Tungsten)
Ideal for applications requiring high mechanical stability and a prefect thermal matching with semiconducting materials. The eForging processes allows to go beyond standard W90Cu10 and allows any CuXWY variants for maximum reliability.
AlSi
The unique combination of light weight, high stiffness and controlled coefficient of thermal expansion for high-tech actuators in wafer chucks for semiconductor manufacturing and applications in optics.
Cu-X-Y
Explore novel and unique combinations of copper with diamond, graphite or graphene plus additional elements that are only feasible through the eForging technology. Go beyond the existing.