Our eForged copper-molybdenum composites are optimized for demanding semiconductor applications. Produced entirely through the powder metallurgy route using our proprietary eForging technology, these materials can be used in the as-sintered condition, eliminating the need for lamination. eForging also enables near-net shape manufacturing, ensuring excellent thermal conductivity, structural integrity, and seamless integration into electronic modules. These properties make Cu-Mo composites ideal for heat spreaders and spacers, fully meeting the performance expectations of the semiconductor industry.
