Fig. 1
Cu-Mo
Cu-Mo composites combine copper’s high thermal conductivity with molybdenum’s stability, making them ideal for heat spreaders in power electronics. These materials ensure stability under continuous thermal cycling without cracking or warping.
Cu-W
Cu-W composites are used in heat sinks, baseplates, and thermal spreaders, minimizing thermal expansion mismatches in power semiconductors and aerospace electronics.
EPoS’s eForging technology allows for customized material compositions, optimizing thermal and mechanical properties for specific applications.
Thermal Conductivity
Cu-Mo composites, while slightly lower in conductivity than CuW, offer improved heat dissipation and significantly lower weight for high-performance applications.
Thermal Expansion
Our materials feature tailored thermal expansion coefficients, balancing thermal stresses and optimizing heat dissipation for maximum performance.
Flexible Designs and Netshape
Ready-to-assemble components in custom shapes and dimensions save time and costs by eliminating additional machining.
Performance
Only efficient heat dissipation allows high-power semiconductor devices to operate at maximum potential without additional space requirements.
Efficiency
Engineered thermal and mechanical profiles ensure superior performance at lower operating temperatures, while eForging enables net-shape components with no need for additional machining.
Reliability
Enhanced heat dissipation in semiconductor devices prevents overheating and ensures stable operation without compromising durability.